For over twenty-five years, Babcock's
Microelectronics Division has been a leading supplier of
hybrid microelectronics for the commercial, industrial,
military, and aerospace sectors. Our extensive knowledge
and tuned expertise of advanced packaging and
high-density interconnect techniques has given us a
competitive edge in this dynamic and fast-paced
Because the task of selecting an appropriate process is
often a time-consuming and complex undertaking,
Babcock's participation can be a valuable advantage in
the early stages of your product's development. Our team
of engineers and designers can assist you in determining
which process will reduce the product's size, weight,
parasitics, system level interconnects and complexity,
while simultaneously improving its reliability,
performance, and thermal management. We also realize
that competitive pricing is essential for the commercial
success of a product; for this reason, we strive to
implement the most cost-effective solution that still
maintains Babcock's commitment to excellence. Whether
your application demands high-volume Chip Scale Packages
(CSP) or sophisticated low-volume Multi-Chip Modules (MCM),
Babcock always delivers a product that meets both
technological and marketplace standards.
Chip Scale Package on Ceramic Interposer
- Ceramic CSPs are very reliable. There is no
'popcorn cracking' of the type that continues to
plague the laminate CSP world. Babcock CSPs are also
qualified under harsh environmental testing
conditions, including 85% RH at 85 degrees C for
1000 hours and -40 degrees C to +100 degrees C
air-to-air thermal shock testing for 1000 cycles.
High Reliability Hybrid Microcircuit
- Semiconductor die and other microelectronic
components are attached and wire bonded in a clean
room environment. Automated equipment is used to
perform these tasks.
Package Sealing in house capabilities include:
parallel gap seam welding and cap welding; automatic
dispense polymeric molding and glob top.
Both automated and purpose built electrical test
equipment is utilized. In house environmental tests
include: burn in; temperature cycling; constant
acceleration; gross and fine leak; and accelerated
Thick film ceramic substrate with 500
- Conductive, dielectric and resistive materials can
be printed on both sides of an alumina substrate.
Interconnects from top to bottom are via plated
through holes. Multiple conductor layers, separated
by dielectric layers, and connected by plated vias
can aid in substrate size reduction.
Resistor values are adjusted to precision tolerances
using YAG lasers. Active (functional) trimming gives
added value to a finished hybrid circuit.